Used VARIAN 3290 #9174285 for sale

VARIAN 3290 is a high-performance sputtering equipment designed for semiconductor device fabrication and thin film processing. 3290 uses a range of standard sputtering processes such as thermal, reactive, and ion assisted deposition to deposit thin films of various material systems including Al, Au, Cr, Ti, Cu, W, Ta, Nb and NiCr alloys. The system is also capable of metals, dielectrics and semiconductor films. VARIAN 3290 unit is the ultimate solution for the production of advanced thin-film architectures. It is specifically designed to deposit thin films from a single platform, enabling customers to achieve high throughputs and optimize layer performance for their device designs. The machine uses an up-to-date pressure and temperature control package which ensures a precise sputtering environment for precise thickness control and structure definition. The tool is capable of varying the sputtering gases to meet the specific needs of the design and the materials being deposited. It also allows for precise control of the temperature and pressure to match the deposition requirements for multi-layered films. 3290 asset is ideal for semiconductor applications due to its Precision Process Control (PPC) technology and its ability to easily switch between process settings, ensuring a fast and reliable process with accurate control over reaction pressures, temperatures and base materials. Additionally, its proprietary diamond-coated vacuum chamber is perfect for long-term use and provides additional protection from reaction contamination. VARIAN 3290 also has an extensive range of automated processes integral to its design, including sample management, recipe control, wafer handling and source usage. The combination of these processes, along with advanced process models that can be customized to the customer's requirements, provide the foundation for best-in-class thin-film layer throughputs and accelerated device development. Overall, 3290 is a powerful, versatile sputtering model, providing advanced insitu process control and an extended range of process capabilities. Its robust design ensures a reliable equipment and fast processing times allow for enhanced production yields.