Used ABA FUV 750 / 50 #9224912 for sale

ABA FUV 750 / 50 Wafer Grinding, Lapping & Polishing Equipment features an innovative design for efficient and reliable grinding, lapping and polishing of fragile, thin films on wafers up to 6 inches in diameter. The system consists of a precision, direct-drive motorized spindle, a motor-driven grinder and lapper, and an abrasive polishing head, all mounted onto a swiveling adjustable frame. With its solid steel construction, robust motor, and low-vibration spindle, the unit is capable of grinding, lapping and polishing thin films with excellent results. FUV 750 / 50 can grind, lap and polish silicon wafers up to 6" in diameter and up to 1/4" thick. The motorized spindle is capable of spinning up to 8000 rpm, providing the grinding and lapping motion necessary for efficient thin film processing. The spindle also features built-in internal cooling, allowing for heat dissipation during grinding and lapping to protect delicate thin films from damage. A variable speed controller allows for fine-tuning of the grinding speed, allowing precise control over the grinding process. The motorized grinder and lapper provides a smooth and repeatable trajectory for accurate results. A range of grinding wheels, lapping pads and other abrasive materials can be used with the machine, allowing users to customize the process to their needs. The adjustable frame allows for precise positioning and alignment of wafers before and during the grinding, lapping, and polishing processes. The tool also features a polishing head with built-in pressure controlled jets for precise polishing. The polishing head is capable of applying up to 25lbs of pressure on the wafer to ensure a uniform and consistent polishing finish. The motor-controlled polishing head is adjustable, allowing users to quickly and easily adjust the polishing head for different polishing jobs. ABA FUV 750 / 50 Wafer Grinding, Lapping & Polishing Asset is a fast and reliable method for processing fragile thin films on wafers. Its sturdy construction and built-in features ensure consistent and accurate results with every use. This model is ideal for semiconductor, medical, and research applications requiring precision grinding, lapping, and polishing of thin films.