Used ACCRETECH / TSK / TOSEI W-GM-4250 #9284073 for sale

ACCRETECH / TSK / TOSEI W-GM-4250 is a professional grade wafer grinding, lapping and polishing equipment. This system is designed to enable the user to perform a variety of abrasive operations on semiconductor, processed material, and other wafers. The unit incorporates a high-performance drive motor, easy-to-use and intuitive operator control panel, and multiple stages of grinding, lapping and polishing equipment. The machine also includes an integrated cleaning and monitoring tool, which is designed to minimize surface residues, defects, and contaminants which could affect the final product quality. TSK W-GM-4250 is outfitted with several modular grinding and polishing stages, two of which are driven by a Precision AC Induction Motor. This motor is designed to provide consistent power and accuracy throughout the grinding process. The asset includes two grinding plates, a polishing table, and two polishing pads to achieve surface finish up to 0.1 μm. An automated wheel spindle is also included to achieve uniform grind rates and prevent build-up of grinding debris on the grinding plate. To better ensure wafer quality, TOSEI WGM 4250 includes a failsafe cleaning model which is designed to prevent surface defects and contamination. This equipment includes a two-stage cleaning process for removal of residues, and a special wafer holder that automatically inspects for surface defects. The grinding process is monitored via a digital meters which allows the operator to set critical process parameters and monitor in real-time. The system is equipped with an emergency stop switch to immediately halt the grinding process in the event of an unexpected setback. ACCRETECH / TSK / TOSEI WGM 4250 is engineered with the latest in grinding and polishing technologies to provide superior surface finish results. This unit is ideal for a wide range of applications, including wafer fabrication, wafer thinning, edge profiling, and polishing. The innovative design of the machine ensures increased throughput and reliability, thereby reducing costs and improving product quality.