Used AMAT / APPLIED MATERIALS Mirra Mesa #9234753 for sale

AMAT / APPLIED MATERIALS / AKT Mirra Mesa is a wafer grinding, lapping, and polishing equipment. It is designed to give high-quality results in the fabrication of semiconductor wafers, as well as other thin and small substrates. The system consists of several components, including the starting wafers, grinding and lapping heads, and the polish head. AKT Mirra Mesa utilizes the latest diamond-based abrasive materials to provide a uniform, efficient, and high-precision finish to the end product. The starting wafer is first clamped into a chuck that is attached to the unit, which rotates the wafer around its axis as it is being ground. The tight tolerance of the chuck ensures that the wafer is always kept at a constant angle and secure during grinding and polishing. An adjustable down force is applied to each grinding and lapping head, which allows for a consistent application of pressure on the wafer. The grinding and lapping heads are equipped with a series of diamond abrasives that enable accurate and controlled grinding of the wafer. The grinding process is then followed up by the lapping process which is performed using a controlled application of diamond slurry and a set of buffing blocks. The diamond-laden slurry is applied to the wafer across the entire surface, which helps to remove any remaining material that could be hazardous to the overall performance of the end product. The buffing blocks are used to further smooth out the surface of the wafer. Lastly, the polish head is used to finish the wafer surface. This head utilizes a finely tuned ceramic media that is specifically designed to achieve a smooth, mirror-like finish. The polish head keeps the motion of the media consistent to ensure that the wafer surface is polished uniformly and without causing any damage to the underlying substrate. In conclusion, AMAT Mirra Mesa is an efficient and versatile wafer grinding, lapping, and polishing machine that can be used to achieve a high quality finish on thin and small substrates. The machine is equipped with highly precise grinding and polishing components that guarantee a consistent and uniform finish, making it the ideal choice for fabricating semiconductor wafers.