Used AMAT / APPLIED MATERIALS Mirra Mesa #9251324 for sale

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AMAT / APPLIED MATERIALS Mirra Mesa
Sold
ID: 9251324
Wafer Size: 8"
Vintage: 2000
Chemical Mechanical Polish (CMP) system, 8" 2000 vintage.
AKT (AMAT)/ APPLIED MATERIALS Ltd./ AMAT / APPLIED MATERIALS / AKT Mirra Mesa Wafer Grinding, Lapping, & Polishing equipment is a versatile machine designed to produce high-quality silicon, compound and ceramic components for the semiconductor and other related industries. This system is built with the latest technology to grind, lap, and polish metal, semiconductor and ceramic substrates with superior quality and accuracy. The unit consists of a spindle head assembly, abrasive or polishing media, two workstations, and various demountable pieces. The spindle head assembly itself houses the motor and other components necessary for efficient operation. The abrasive or polishing media allows the user to adjust the speed and force applied to the wafer surface during processing. Two workstations are included with the machine, one containing a Fluid Sampling Analyzer and the other a Densimeter Control Unit. The Fluid Sampling Analyzeris capable of analyzing and controlling the sample temperature, flow rate, and pressure. This unit is important for the reliable production of silicon wafers and other components with efficiently running process cycles. The Densimeter Control Unit provides an even finer level of control, allowing precise control of the sample surface roughness and uniformity. AMAT / APPLIED MATERIALS / AKT LTD./AKT Mirra Mesa Wafer Grinding, Lapping, & Polishing Tool comes with various demountable pieces such as a diamond grinding wheel, abrasive or polishing belt, a molybdenum disulfide coating to absorb the wear particles generated during polishing, and a vacuum asset. The diamond grinding wheel allows for accurate and repeatable grinding of the wafer surface. The abrasive or polishing belt can be used to prepare specific process cycles for the best results. The molybdenum disulfide coating is also essential for reducing abrasive wear on the parts processed with this model. Finally, the vacuum equipment keeps the environment clean and particles away from the wafers and process materials. In summary, AKT Ltd./AMAT Mirra Mesa Wafer Grinding, Lapping, & Polishing system is a full production unit designed for precise and efficient grinding, lapping and polishing of silicon, compound and ceramic substrates. The machine components allow a controlled manufacturing process with focus on surface finish, uniformity and part production cycles. The machine is ideal for quickly producing high-quality parts and products for the semiconductor and optical industries.
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