Used AMAT / APPLIED MATERIALS Mirra #9142627 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

AMAT / APPLIED MATERIALS Mirra
Sold
ID: 9142627
Wafer Size: 8"
Vintage: 1998
CMP Oxide systems, 8" 1998 vintage.
AMAT / APPLIED MATERIALS Mirra is a wafer grinding, lapping, and polishing equipment designed specifically for semiconductor and optoelectronics applications. This process is essential in the manufacture of advanced, high-performance integrated circuits. AMAT Mirra system is capable of performing multiple processes at high speed and with high accuracy, resulting in better yields and overall quality of the products. The core component of the unit is the grinding, lapping and polishing station. This station is composed of two separate components: the abrasive process head and the wafer chuck. The abrasive process head is the component that controls the rate of grinding, lapping, and polishing processes for the wafers. It houses the necessary tools for these operations which are grindstones and diamond pads. The wafer chuck is the component of the machine that holds the wafer in place and allows for the precise manipulation of the wafer during the process. It is designed to provide secure and accurate positioning of the wafer during the entire process. The tool also includes a vision asset and a process monitoring model. The vision equipment is used to ensure the proper alignment of the wafer before the process begins, while the process monitoring system is used to track the progress of the different operations and make sure that they are completed correctly. APPLIED MATERIALS Mirra unit is equipped with a data acquisition and control machine which allows for easy access to the results of the process. The tool also includes an in-situ wafer testing asset which is used to measure various parameters during the process. This allows for a more accurate understanding of the process and provides feedback to the operator. The model is designed to operate in a high-temperature environment and is designed for use with corrosive materials. The equipment is highly efficient and utilizes a variety of techniques to reduce the amount of energy and materials used in the process. The system is also designed for easy maintenance and can be easily updated and upgraded to keep up with industrial trends and technological advancements. Overall, Mirra is a reliable and efficient wafer grinding, lapping, and polishing unit that provides high-quality results. It is designed for high-speed, high-accuracy performance, with easy access to data and a reliable process monitoring machine. The tool is also designed to reduce energy consumption and waste and is very easy to maintain.
There are no reviews yet