Used AMAT / APPLIED MATERIALS Mirra #9241773 for sale

AMAT / APPLIED MATERIALS Mirra equipment is a highly advanced wafer grinding, lapping and polishing tool designed to help semiconductor and microelectronics manufacturers achieve precise surface preparation and perfect flatness. The system utilizes precision motor controls, dynamic force feedback, ultra low-vibration performance, and vacuum wafer chuck to maximize accuracy and reproducibility. The unit features a large processing window, allowing for wafer size up to 200mm in diameter, capable of handling numerous wafer types such as standard grade silicon, quartz and fused silica. Its proprietary force-feedback technology enables active control over the process and accurate surface preparation on the order of 5-10 nm. This is achieved with its innovative dynamic grinding option, which provides for reduced grinding force, improved profile uniformity and increased process throughput. AMAT Mirra machine is suitable for multiple applications such as metal and dielectric film planarization, wafer thinning, and grinding for silicon-on-insulator (SOI) and other advanced IC structures. The tool has a variety of grinding options available, from rough grinding to finer lapping processes such as swing lapping. APPLIED MATERIALS Mirra asset also offers a number of specialized tools such as wheel and platen cleaners, dust extraction systems, special high-precision wafer chucks, and additional optical and interferometric measurement options for process monitoring and control. The highly automated model provides flexibility and precise control over the grinding process, allowing for a variety of options such as an integrated wafer chuck, adjustable frame force, adjustable platen pressure, motor control, and automatic grinding cycle control. Additionally, the equipment's real-time material removal rate monitoring and slip control eliminate process artifacts. In summary, Mirra system is a reliable and feature-rich tool for precise wafer grinding, lapping and polishing applications. It can be used to achieve high-precision surface preparation with its automatic force and pressure feedback capabilities, real-time material removal rate monitoring, and automatic grinding cycle control. This advanced unit provides significant improvement over traditional methods, making it an invaluable tool for semiconductor and microelectronics manufacturers.