Used AMAT / APPLIED MATERIALS Reflexion LK Oxide #9292971 for sale

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AMAT / APPLIED MATERIALS Reflexion LK Oxide
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ID: 9292971
Dielectric CMP system.
AMAT / APPLIED MATERIALS Reflexion LK Oxide equipment is a wafer grinding, lapping, and polishing system that combines advanced technologies with user-friendly software for quick, precise and cost-effective production of wafer substrates. The unit produces high aspect ratio, high-uniformity wafers and ultra-thin layers with excellent electrical and thermal properties. AMAT Reflexion LK Oxide machine consists of three primary components: the coating head, the lapping/polishing head and the grinding head. The coating head contains an integrated vacuum chamber for precise deposition of amorphous silicon nitride, silicon dioxide and other oxide layers. The lapping/polishing head is engineered to provide uniform polishing of multiple substrates. It also incorporates a two-zone holder to facilitate simultaneous polishing of multiple wafer substrates. Finally, the grinding head incorporates an abrasive disk for efficient grinding of wafer substrates. This disk is capable of removing silicon oxide and other layers from wafer surfaces. APPLIED MATERIALS Reflexion LK Oxide tool is specifically designed for the production of wafers with ultra-thin layers. It is capable of producing ultra-thin layers of just 11nm with uniformity better than 1nm/cm2. The asset is also designed to provide precision planarization without the need for aggressive grinding or polishing. This helps prevent damage to the wafer surfaces and ensures consistent wafer qualities. In order to ensure precision wafer coatings, Reflexion LK Oxide model uses advanced Software Co-Analysis technology. This scan accelerates product development and ensures consistency from wafer to wafer. AMAT / APPLIED MATERIALS Reflexion LK Oxide equipment is ideal for demanding production applications. Its advanced technologies, user-friendly software and precise planarization make it the perfect solution for the production of complex wafer substrates. It offers increased efficiency, improved product quality and decreased production costs for maximum value and cost savings.
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