Used AMAT / APPLIED MATERIALS Reflexion #9240161 for sale

AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing equipment is a highly advanced manufacturing system that produces superior quality semiconductor wafers. The unit utilizes advanced grinding, lapping, and polishing processes to ensure perfect surface uniformity and excellent yields. It is capable of producing wafer thicknesses between 50 and 250 microns with diameters ranging from 2.5 to 12 inches. At its core AMAT machine uses two Wafer Grinders, two Lapping machines and one Polishing machine. The Wafer Grinder is the initial step that prepares the wafer surface for polishing and further processing. It grinds the wafer to a specified height and thickness with uniformity and accuracy. The Lapping process consists of two machines; one for coarse lapping and the other for fine lapping. This process finishes the surface and removes any defects that may be present. The Polishing Machine then takes the lapped surface and further polishes it to a super fine finish with a very low Ra. APPLIED MATERIALS tool comes equipped with several safety and reliability features. These include mechanical interlocks, electronic interlocks and emergency stops. They also include advanced sensor systems which monitor the process and help identify any issues that may arise. The asset also has multiple operator interfaces which allow for easy and efficient operation and control. AMAT / APPLIED MATERIALS model is the perfect solution for any semiconductor manufacturer. It is highly reliable, ensures superior quality results, and has specific safety and reliability features. Its advanced grinding, lapping and polishing processes guarantee the perfect surface uniformity and excellent yields every time.