Used AMAT / APPLIED MATERIALS Reflexion #9282203 for sale

AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing Equipment is designed to provide precise, automated control for precision grinding, lapping, and polishing of a range of semiconductor wafers. The machine utilizes advanced motion control, ultra-precise motorized platform, and advanced feedback control technologies to ensure precise control of all grinding, lapping, and polishing functions. First, the machine uses a precision motorized platform to adjust the wafer's position before grinding. The motorized platform can be adjusted in increments of one-tenth of a millimeter, allowing repeatable, precise grinding of the wafer. Different wafers can also be handled with separate platforms, allowing the machine to grind and lap other types of wafers. Second, the machine utilizes advanced feedback control technologies to further enhance its precision. A force-controller measures the forces acting on the wafer and the grinding surface, allowing the machine to adjust the speed and pressure of the grinding process. This ensures that wafers experience only the amount of force necessary to achieve the desired result, resulting in precise grinding and polishing. Third, the machine utilizes directional substrate forces for precise lapping and polishing. The machine makes tiny adjustments in the direction and force with which the wafer is being lapped, providing perfect lapping on curved and/or complex shapes. This ensures that the wafer is perfectly shaped and polished, with no surface irregularities. Finally, AMAT Reflexion system is designed with user-friendly controls, enabling easy setup and operation by wafer processing personnel. The unit's adjustable control parameters allow users to customize the grinding, lapping, and polishing cycles for precise results. In conclusion, APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing Machine offers a precise and automated way to grind, lap and polish semiconductor wafers. The machine utilizes advanced motion control, precise motorized platforms, and advanced feedback control technologies to ensure accurate, repeatable grinding, lapping, and polishing. The machine is also equipped with user-friendly controls, allowing it to be easily operated by wafer processing staff without intensive operator training.