Used BUEHLER Automet 250 #9265634 for sale

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ID: 9265634
System.
BUEHLER Automet 250 is an advanced wafer grinding, lapping and polishing equipment designed for precision parts. It offers a wide range of capabilities and features, including a highly accurate grinding spindle, precise feedrate and speed control, as well as an independent spindle speed selection. It provides a 40-kHz frequency response, and features a high-torque motor and robust belt drive. Automet 250 is designed to meet the needs of the most demanding applications. BUEHLER Automet 250 utilizes a high accuracy, direct drive air bearing spindle designed for ultra-precise grinding and polishing operations. The direct drive spindle is designed to provide a maximum rotation speed of up to 5,000 rpm and is able to maintain a tolerance of +/- 0.5 micron. The spindle also offers a wide range of speed selection, enabling Automet 250 to offer precise grinding and polishing operations. The direct drive also ensures a high torque transfer, allowing for a consistent feedrate and reduction in cycle times. BUEHLER Automet 250 is equipped with a robust belt-drive system, offering superior operational stability. The unit requires minimal maintenance and provides a controlled, uniform feeding speed. It also offers adjustable belt tension to ensure accuracy and repeatability. Automet 250's grinding spindle is precision controlled servo motor coupled with an electronic controller designed to allow users to select a very precise grinding and lapping speed, feedrate, and pressure profile. The machine is also capable of infinitely variable feed rates from 0-400 millimeters per minute, adjustable to a 0.001-millimeter chip size. BUEHLER Automet 250 features a full-featured, digital display that provides real-time machine operation information. This includes feedrate and speed selection, as well as a timer. Automet 250's optional digital profile display is capable of displaying the profile, enabling users to directly monitor the profile of the grinding and lapping process. Overall, BUEHLER Automet 250 is a highly/advanced wafer grinding, lapping and polishing tool suitable for precision parts. Its features include a high accuracy, direct drive air-bearing spindle, robust belt drive, precise servo motor control, a full-featured digital display, and more. It is designed to meet the needs of the most demanding applications and offers reliable, repeatable performance.
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