Used BUEHLER ECOMET 4 #9142327 for sale

BUEHLER ECOMET 4 is a powerful wafer grinding, lapping, and polishing equipment designed specifically for the manufacture of silicon wafers, sapphire substrates, and other thin materials. It is a highly versatile and precise solution for even the most demanding applications. ECOMET 4 utilizes diamond abrasive film grinding, lapping, and polishing technology to create a uniform surface finish and precise thickness for a wide variety of materials. The unit is designed to be easy to use and highly automated, allowing for quick and repeatable processes. The main components of the system include a diamond abrasive lapping and film polishing wheel, a specially designed table with accurately laser etched perforations, and a grinding/lapping plate. The abrasive wheels are constructed of diamond-impregnated material for maximum abrasive capabilities. The table enables precise control over the grind depth and profile, and the plate offers excellent planarity for the specimen. BUEHLER ECOMET 4 features an intuitive, user-friendly graphical interface with sophisticated monitoring and control functions, allowing users to accurately adjust and monitor the grinding, lapping, and polishing processes automatically. This ensures repeatable and reliable results every time. Additionally, a wide range of process parameters can be stored to further enhance productivity. The unit also features a range of safety features such as a safety interlock machine with audio and visual alarms, and automatic shut-off. These critical measures ensure the tool remains safe and unharmed during operation, and helps prolong the life of the unit. ECOMET 4 wafer grinding, lapping, and polishing asset is an ideal solution for industries such as semiconductor, MEMS, microelectronics, optical, and medical device manufacturing. With its superior accuracy and flexibility, it is a must-have tool for any serious manufacturing operation.