Used CUSTOM (Wafer Grinding, Lapping & Polishing) for sale

Wafer grinding, lapping, and polishing equipment play a crucial role in the semiconductor manufacturing industry. 'CUSTOM' is a leading manufacturer known for their high-quality systems used in the production of wafers. Their units are designed to provide precise and efficient grinding, lapping, and polishing processes. Analogues of the 'CUSTOM' machines are available in the market, but what sets them apart is their advanced technologies and customizable features. These tools offer several advantages, including increased accuracy, improved surface quality, reduced production time, and enhanced productivity. The 'CUSTOM' assets are equipped with robust motors, precision control models, and advanced abrasive materials to ensure optimal results. For instance, 'CUSTOM' offers equipment with varying sizes, such as the 72" and 52" models. The larger size systems can accommodate bigger wafers, allowing for efficient processing of a higher quantity of wafers in one cycle. These units are widely used in applications like silicon wafer processing, MEMS fabrication, and optical substrate production. Overall, 'CUSTOM' wafer grinding, lapping, and polishing machines are highly regarded in the semiconductor industry for their exceptional performance, versatility, and ability to meet the demanding requirements of wafer fabrication.