Used DISCO DAG 810 #9228239 for sale

DISCO DAG 810 is a highly versatile, fully automated, and closed-loop wafer grinding, lapping, and polishing equipment. The system is designed to meet the needs of advanced semiconductor device manufacturing, where high-volume production of wafers with superior surface finish and greater accuracy is required. DISCO DAG810 features a dedicated machine platform with a single table design that accommodates up to eight process cassettes, each capable of holding up to 150 wafer pieces. This allows for the high-speed sequential processing of multiple wafer sizes. The table also features linear motion at both the x- and y-axis so that the wafers can be accurately and quickly positioned to the processing position The unit uses the latest grinding, lapping, and polishing processes to quickly and accurately achieve the desired surface finish. The dedicated diamond grinding wheels, plate grooving, and polishing discs are mounted on DAG 810, allowing for quick and easy replacements when needed. The grinding wheels used for the grinding process are uniquely designed to produce a fine, smooth surface finish. The grooving tools are placed at the bottom of the machine and are used to create grooves and ridges in the wafer surfaces for improved contact between the wafer and the dopant. The polishing discs used in the polishing process have superior abrasive properties that ensure a highly polished surface finish. The user-friendly software interface of the tool enables the user to easily and conveniently monitor and control the parameters of each process. The monitoring asset provides real-time feedback on the process parameters, enabling quick and precise adjustments to ensure the best quality results. The model also provides self-diagnostic capabilities to ensure that the equipment is always running at optimal levels. DAG810 is designed to offer fast and accurate wafer grinding, lapping, and polishing processes while maintaining the highest standards of quality control and providing maximum flexibility. This system is the ideal solution for the efficient and accurate processing of a variety of wafer sizes, shapes, and surfaces.