Used DISCO DAG 810 #9262839 for sale

DISCO DAG 810 wafer grinding, lapping & polishing equipment is a precision system designed for semiconductor, compound and optoelectronic wafer polishing and processing. The unit is designed to provide single wafer processing with accuracy, repeatability and flexibility. The machine has a low temperature design, allowing for temperature-sensitive substrates to be processed safely. DISCO DAG810 has the capability to grind, lap and polish a range of substrates including GaAs, InP, quartz and sapphire, with an edge radius as low as 0.25 microns. The tool also provides edge-rounding and faceting to create the desired substrate shape for specific processes. DAG 810 wafer grinding, lapping & polishing asset also offers the option of wafer sublimation, a process that removes surface impurities by burning off the surface layers with high heat. The model also has an optical coating removal option, which uses laser optics to remove thin oxide layers as thin as 5nm. The equipment is highly configurable and is designed to run up to 4 pads simultaneously. To ensure the accuracy and repeatability of the process, the system is equipped with temperature and pressure control systems, collision detection and monitoring systems, and material tracking systems. The process itself is fully automated, and the wafers can be configured to the unit's automated loader for unattended processing. The machine's control tool can be fully customized for a variety of wafer types, and the asset is compatible with a wide range of automation systems. Overall, DAG810 wafer grinding, lapping & polishing model provides a reliable and efficient platform for single wafer polishing & processing, with accuracy, repeatability, and flexibility. It is an ideal solution for a variety of industries, such as semiconductor, compound and optoelectronic wafer production.