Used DISCO DFG 82IF/8 #9184274 for sale

DISCO DFG 82IF/8 Wafer Grinding, Lapping & Polishing Equipment is designed to accurately and efficiently grind, lap and polish wafers of various sizes, materials and thicknesses. This automated system is capable of handling wafers up to 8-inch up to a thickness of 200 μm with a high degree of accuracy and repeatability. The unit is equipped with an industrial-grade air-bearing spindle and an inline feed and control machine which ensure optimal accuracy and precision. The tool features a high-precision vertical feed mechanism which allows for accurate and consistent wafer transport. It uses a variable speed belt drive for intra-axis and a direct drive for inter-axis movement. The asset also has a high-precision AD/DA spindle speed control model which ensures high accuracy and consistent grinding/polishing results. DISCO DFG-82IF/8 includes a robust hydroplaning unit which provides superior surface finish on the wafers. This equipment also features a pair of automated grinding, lapping & polishing heads that offer efficient grinding, lapping and polishing of wafers. This unit has a vacuum chuck that securely holds the wafer in place during processing. DFG 82 IF/8 also offers improved process control, which is achieved by incorporating advanced embedded diagnostic monitoring functions such as frequency analysis and PDCA (Plan-Do-Check-Act) cycle. This system is also equipped with an RFID chip for easy traceability and support of real-time data. DISCO DFG 82 IF/8 is built with a sturdy and durable body to ensure that it can operate in a production environment for a long term. The unit is capable of providing precise and uniform finish on wafers even when working with coarse materials. Moreover, the machine comes with an intuitive graphical user interface (GUI) which makes it easy to use and configure. Overall, DFG-82IF/8 is an efficient and reliable wafer grinding, lapping & polishing tool which offers excellent accuracy and repeatability. It is an ideal solution for industries such as microelectronic manufacturing, semiconductor manufacture and medical device manufacturing.