Used DISCO DFG 83H/6 #9002896 for sale

DISCO DFG 83H/6 Wafer Grinding, Lapping, and Polishing equipment is an industrial workhorse for the semiconductor industry. It is designed for mass production of devices and features a dual spindle platform which enables high-precision grinding, lapping, and polishing of a variety of substrates. The system achieves sub-micron-level precision, ensuring that the finished devices will meet or exceed manufacturers' specifications. The unit is comprised of a base machine with two independent spindles and two arm attachments which allow for two devices to be processed simultaneously. The spindle drive is powered by a 6-axis CNC motion machine, which is capable of speeds up to 500 RPM for grinding, and 150 RPM for lapping and polishing. It is capable of automated loading and unloading of substrates with a pneumatic end-effector, which allows for the use of a wide range of substrates. The tool comes with a selection of grinding and polishing tools, including diamond lapping films and polishing compounds. In addition to its impressive performance characteristics, DISCO DFG 83H6 asset is very easy to use and maintain. The controls are designed in a logical fashion, making set up and operation a breeze. It also includes a built-in safety interlock model which prevents physical contact with the device being processed. The main components are housed in air-tight compartments for easy accessibility. Maintenance is also simple, as the equipment includes self-diagnostic capabilities and built-in alerts if the operations require attention. DFG-83H/6 is a reliable and efficient wafer grinding, lapping, and polishing system that is ideal for high-volume production of devices. Its advanced features and controls ensure consistent results, making it the perfect tool for any mass production application.