Used DISCO DFG 83H/6 #9100518 for sale

DISCO DFG 83H/6 Wafer Grinding, Lapping and Polishing Equipment is a high-precision, automated and reliable system designed to facilitate the consistent production of ultra-smooth semiconducting and other wafers of extraordinary uniformity. The unit is composed of an industrial-grade robot for automated material loading and unloading coupled with a compact grinding, lapping and polishing cell with 7 rotating spindles for optimal material consistency and flexible workflow. The lapping and polishing cell is controlled with a PCWorkstation centrally situated in the workspace, providing near-time data feedback of the material's status and progress of the machine. The integrated work space is designed to ensure safe operation for production personnel, providing guarding to the four sides and a timer-controlled ventilation tool to ensure a productive working environment. The asset comes standard with features such as remote monitoring capability, a precise dosing station to add lubricants, coolants and other flushing agents, and a low-noise, full-size pump model to meet a variety of process needs. The equipment is equipped with a safety MES, ensuring precision throughout the entire production process. The grinding and lapping spindles are designed to reduce the breakage of fragile wafers while providing an exquisite finish. They are powered by severe-duty electric motors, allowing them to conduct processes or cuts up to 150 microns per minute with tight tool tolerances. Additionally, they are capable of creating a near-perfect surface planarity and edge rounding effect for the higher quality wafers. The ergonomically designed user interface ensures intuitive and easy operation and efficient communications with the PCWorkstation while still providing flexibility to the user by installing additional options, such as a data-logging function or converting the machine into a multi-pass configuration so it can handle several wafers simultaneously. Overall, DISCO DFG 83H6 Wafer Grinding, Lapping and Polishing System is highly efficient advanced tool designed to create high-quality, super uniform wafers with extraordinary precision. The unit is reliable, safe, and easy to use. It is the ideal choice for fabrication centers and laboratories looking to confidently execute their lapping and polishing processes.