Used DISCO DFG 840 #9002892 for sale

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DISCO DFG 840
Sold
ID: 9002892
Wafer back grinders.
DISCO DFG 840 is a wafer grinding, lapping and polishing equipment designed to provide high-precision processing for semiconductor devices and specialized materials. This system offers precise fine grinding, lapping and polishing for wafers up to 8 inches (203mm) in diameter. With its advanced technology, this unit has the capability to process wafers up to twice the speed of comparable equipment. DISCO DFG840 incorporates a precision spindle motor for grinding and lapping operations. This motor spins at up to two thousand revolutions per minute (rpm), enabling high-precision grinding, lapping and polishing. The spindle motor uses a servomotor drive for precise synchronization and control, ensuring the highest quality surface finish for the products. The machine utilises a high-resolution optical alignment microscope to assist in setting the motor axes to ensure smooth operation on the workpiece. The microscope also assists with surface finish checking. This tool also incorporates a high-precision transducer for alignment and measuring, as well as temperature monitoring. This ensures that the device's temperature is kept within an acceptable range throughout the grinding and polishing process. DFG-840 is equipped with a user-friendly touch-screen panel, which enables the operator to adjust and control the processing parameters with ease. This helps to ensure consistent results and efficient processing. This asset is capable of processing materials such as silicon, germanium, quartz, GaAs, stainless steel, and it can also be used for other both hard and soft material surfaces. With its high-speed grinding and lapping capabilities, DISCO DFG-840 is an ideal solution for precise, high-speed production processing.
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