Used DISCO DFG 840 #9056223 for sale

DISCO DFG 840 wafer grinding, lapping & polishing equipment is a state-of-the-art system designed for ultra-precision grinding and lapping of various types of wafers. The unit utilizes the latest in technology to provide the highest level of quality, accuracy, and precision. The machine features a proprietary direct drive spindle for precise grinding and lapping and a sealed environment for clean and consistent grinding. The direct drive spindle provides significantly higher precision than conventional spindle-driven systems, offering a more consistent wafer finish and greater control over the grinding process. The direct drive also ensures higher-quality and more consistent results compared to traditional methods. The sealed environment eliminates any potential for contamination, allowing operators to use the tool to produce cleaner, superior-quality wafers. DISCO DFG840 features precision movement and positioning of the wafer through the grinding process. The asset utilizes linear motor stages to provide precise, rapid movement over all axes, allowing for the elimination of vibration and removal of material without degradation of the resulting wafer. The model also features a load-sensing equipment that ensures an even surface finish, providing maximum accuracy and precision. DFG-840 is capable of grinding and lapping wafers up to 200mm in size. The system also features an automated wafer alignment unit for accurate finish lapping. The alignment machine works in conjunction with the grinding process, enabling the operator to accurately and quickly align the wafer in the grinding cycle, ensuring a uniform and consistent final product. The tool also features a sophisticated data acquisition and control asset that offers the operator the ability to control, monitor, and optimize the grinding process. The model is capable of automatically detecting and correcting any problems that may occur during grinding, ensuring optimal operation. DFG840 is a powerful and precise equipment that provides the highest quality and accuracy in wafer grinding, lapping & polishing. Its robust design and advanced technology enable it to offer operators superior grinding and lapping results, maintaining consistently superior results with each cycle.