Used DISCO DFG 840 #9119555 for sale

DISCO DFG 840 wafer grinding, lapping & polishing equipment produces flat, highly polished surfaces on wafers, including silicon, ceramics and glass, of up to 8.0 inches in diameter. This automated wafer grinder/polisher is equipped with a 40-position servo wafer loader to significantly reduce user exposure to the grinding and polishing environment. In addition, a water jet nozzle wets the abrasive paper catch tray, which keeps the tray clean and reduced the need for user maintenance. The grinding, lapping and polishing process begins when the wafer is placed on the rotary table of DISCO DFG840 system. The two front spindles in this unit will take the wafer and move it to the grinder station. A low-torque, low speed spindle positions the wafer and then a high-torque, high speed spindle is used to grind the wafer. The rotating grinding disc rapidly cuts away material from the top surface of the wafer, producing a flat and smooth surface ready for the next step in the process. The lapping stage uses a lapping disc and paste containing diamond particles to further smooth the wafer's finish in selected areas as determined by the operator. This stage prepares the wafer for polishing and removes any residual dips that may remain after the grinding stage. The polished stage is next, and is performed using similar processes, but with a finer grade lapping disc and a finer grade polishing pad that is used to polish the surface of the wafer. In addition, DFG-840 is equipped with a wafer chamfering unit designed to reduce small irregularities on the edge of the wafer. This unit utilizes a diamond wheel to control the width of the chamfer and ensures that the chamfer is uniform on each wafer. Finally, after the polishing process is completed, a wafer purity inspection is done to ensure that no surface foreign material is present before the wafers are sent for inspection and final packaging. Overall, DFG840 machine is a rugged, reliable and accurate automated wafer grinding, lapping and polishing tool capable of producing high quality surface finishes on wafers of up to 8.0 inches in diameter. Its superior design and construction enable the asset to remain accurate and efficient over time and provide a long lifetime of consistent performance. It is considered to be one of the industry's premier wafer grinding, lapping and polishing systems.