Used DISCO DFG 840 #9155027 for sale

DISCO DFG 840 is a state-of-the-art wafer grinding, lapping and polishing equipment from DISCO Corporation which combines high precision, high productivity and considerable cost savings in one device. The system is designed to handle a range of materials, including Si-epi wafers up to 8 inches in diameter and are designed to process single side, double side, and groove grinding and polishing operations with industry-leading precision and accuracy. The heart of the unit is the combination of a two-axis OCB (outer cassette basis) carrier and an integrated, high-resolution video inspection machine. This enables the tool to precisely locate the target wafer and locate its geometrical center in a highly precise manner to ensure that all processing errors are easily identified and avoided. Additionally, a load-bearing vacuum chuck table and a tilt/lift mechanism ensure that wafer strain is minimized and that the asset is able to provide a consistent WCR (Wafer Carrier Rotation) for uniform grinding and polishing results. DISCO DFG840 also features a unique Digital-IPC control model, which makes use of its own proprietary software. This software is designed to optimize the processing time and the result accuracy of the equipment. Additionally, it makes use of a host of advanced functions, such as flexible recipe selections and simulation tools, which enable the engineers to precisely monitor and customize DISCO process while controlling all parameters with ease. In terms of process capabilities, DFG-840 is able to process a range of materials, including SiO2, GaAs, SiC and GaN, with a wide range of thicknesses. It can grind and/or polish both single side as well as double sided wafers, as well as groove and edge grinding operations. Additionally, it is also capable of accurately machining a variety of edge shapes and polishing angles, providing excellent WCR repeatability and uniformity for each individual process. Last, but not least, the system is also quite versatile, with a number of "plug and play" options for rotary and stepper axis, multiple grind, lapping, polishing and loading/unloading configurations, as well as multiple sizing and routing options. Moreover, the machine can be integrated into existing grinding/lapping/polishing line and offers a number of automated functions for tool inspection, machine maintenance, and process optimization. Overall, DFG840 is a powerful and reliable wafer grinding, lapping and polishing unit, which is capable of providing industry-leading precision and cost-efficiency in one machine.