Used DISCO DFG 840 #9155401 for sale

DISCO DFG 840 Wafer Grinding, Lapping & Polishing equipment is a fully automated machine that is designed to precisely and accurately grind, lap and polish wafers. The system was developed by DISCO Corporation, a company headquartered in Japan specializing in the manufacture of precision semiconductor processing tools. DISCO DFG840 is an all-in-one grinding and polishing platform that can be used for all types of wafers such as glass, ceramic, and polycrystalline. It can process a wide range of wafer sizes and thicknesses, from 0.3mm to 5mm. The unit allows for on-the-fly adjustments to meet the specific manufacturing requirements of the wafers being processed. DFG-840 is compatible with all kinds of polishing pads and features an integrated vacuum transport machine that ensures efficient handling and processing of wafers. It has two grinding modules that can be operated simultaneously or independently of one another. This allows for improved grinding and polishing precision and repeatability. The machine has a direct drive motor that enables high grinding accuracy, as well as a low-vibration design. The motor is capable of spinning up to 10,000 RPM, allowing for fast and efficient grinding and polishing processes. Additionally, the machine has an intuitive user interface which makes it easy to program and monitor the processing parameters. The tool also features a built-in CCD camera that allows for the analysis of the wafers during different stages of processing. This allows the asset to identify irregularities which can then be corrected accordingly. The CCD camera also provides feedback regarding the quality of the wafer so that operators can make necessary adjustments and ensure the highest quality product. DISCO DFG-840 is reliable and easy to maintain, has a very low sound level, and offers precise wafer processing capabilities. Its advanced features, such as automated operation and multi-axis control, make it ideal for high-volume production. In summary, DFG840 Wafer Grinding, Lapping & Polishing model is a reliable and effective way to prepare a wide variety of wafers for further processing and production.