Used DISCO DFG 840 #9177184 for sale

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ID: 9177184
Vintage: 1995
Back grinder 1995 vintage.
DISCO DFG 840 Wafer Grinding, Lapping & Polishing Equipment is a multi-functional, automatic system for grinding, polishing, and lapping semiconductor wafers. It utilizes a computer-controlled, 4-axis grinding, lapping, and polishing unit to perform its operations at high speeds and in perfect precision for fine, flat results. DISCO DFG840 is capable of grinding, lapping, and polishing materials between 0.025 and 3.2mm thickness and producing a flatness variation from 1µm to 0.25µm on the wafer surface. To do this, it utilizes a three-splitting device which divides the sample into up to three independent cutting points, ensuring perfect alignment with the substrate. In addition, the machine features a specialised active cooling machine to help maintain air-cooled accuracy and consistent off-axis polishing during high-speed operations. This is designed to ensure that all parts of the wafers are evenly processed, ensuring a uniform, high-quality finish. The tool also features a built-in Automated Assay Measurement asset which can measure the shape and size of the sample wafer, as well as the film thickness and flatness values for both pre and post-processing procedures. This feature allows the user to continually check the quality of the results and take corrective action to adjust any errors. Furthermore, the model comes with advanced user-friendly software for real-time process control, allowing users to monitor and control the entire process with ease. This software also allows users to store the measured data and print out any reports, enabling them to review the results at any time and take advantage of the equipment's data security and preventative maintenance feature. DFG-840 Wafer Grinding, Lapping & Polishing System is an incredibly efficient, cost-effective tool for both small and large-scale processing of Semicon wafers. This versatile unit provides advanced control, high speed, and precision for the production of high-quality wafers in a wide range of sizes and thicknesses, with little operator attention.
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