Used DISCO DFG 840 #9210019 for sale

DISCO DFG 840 Wafer Grinding, Lapping & Polishing Equipment is ideal for wet-process grinding, lapping and polishing of semiconductor substrates and other precision materials. This system is built on a reliable and rigid four-wheel mobile design which requires minimal floor space and still provides excellent unit flexibility. Power supplied to the machine comes from conventional 230 V power supply, with a max consumption of 2.2kW. It includes a full range of options for process automation with intuitive human machine interface (HMI) for easy setup and operator control. The tool head of DISCO DFG840 is designed to accept 5-inch (127mm) wafers of up to 0.3mm thickness, and incorporates a highly precise 3-axis positioning device which allows for full 6-axis motorized motion. Vacuum suction and rotating chucks secure the wafers in place during the process, both of which can be adjusted to accommodate a wide range of wafer sizes and thickness. The tool head also contains an air bearing spindle which is ideal for part loading/unloading and grinding wheel installation/removal. DFG-840 houses two grinding spindles, each of which has two precision-made grinding wheels mounted for lapping and polishing processes. Powered by an electronically-controlled and variable speed platen, the grinding wheels can operate from 600-30,000 rpm, enabling users to select the optimum speed for each process. The integrated water cooling helps to prevent particle re-distribution and move heat away from the grinding point for increased process accuracy and repeatability. For repetitive processes, DISCO DFG-840 offers a curved calibration plate which helps to compensate for non-uniform substrate shape. The tool also allows for porting of substrate surfaces to predefined fluids and substrates to be lapped or polished for backside planarization or for mirror surface applications. In addition, the asset is configured with a full suite of alarms and diagnostics modes for secure and safe processing. The sturdy design and its comprehensive range of features ensures that DFG 840 offers maximum model rigidity and up-time as well as low operating costs. The ultimate result of the grinding, lapping and polishing processes carried out by the equipment is a near perfect planarization and surface form accuracy. By using the hands-free operation capabilities provided by the system, users can achieve the highest quality finishes on their semiconductor substrates.