Used DISCO DFG 840 #9215380 for sale

DISCO DFG 840 is a dynamic, high-precision wafer grinding, lapping and polishing equipment designed for multi-step wafer processing. It is the ideal choice for back grinding, thinning, and damage removal applications such as shallow trench isolation (STI) polishing and trench depth adjustment. DISCO DFG840 is powered by a high-performance platform that features high-end process control and precision drive technology. This technology ensures consistent high-precision processing and maximum efficiency. It also enables tight process control and a wide range of abrasive options, from diamond abrasives to high-efficiency ceramics. DFG-840 features advanced lapping, grinding and polishing functions that can be used to produce thin, uniform layers even with complex infeed motion. This makes it ideal for back grinding and thinning of wafers. It also features a "slip and stick" flange holder for stable grinding and polishing of STI layers. DFG 840 is fully automated with an automated wafer infeed system that is designed to quickly process up to 22 wafers at once, and to minimize operating cost. The infeed unit reduces the number of time-consuming steps associated with manual loading. DISCO DFG-840 features a high-performance flow-through process that maintains a constant wafer surface temperature throughout the grinding and polishing stages. This ensures high throughput with excellent consistency. The machine also features an integrated water cooling tool for cooling abrasives and maintaining a constant temperature. This allows consistent wafer thickness for higher yields and low edge taper. DFG840 offers a wide variety of custom substrates and advanced customizable grinding and polishing processes that are ideal for a variety of applications, such as smoothing of small circuits, production of accurate cavities, removal of irregularities in thin layers, and more. Several safety features are also included to ensure operator safety and reduce the risk of product contamination. The asset includes a full-floor mat for slip protection and a dust collection model to reduce airborne particle contamination. In summary, DISCO DFG 840 is a high-precision wafer grinding, lapping and polishing equipment that is designed for multi-step wafer processing. It features advanced process control and precision drive technology, an automated wafer infeed system, a flow-through process and a variety of customizable grinding and polishing processes. These features make DISCO DFG840 an ideal choice for back grinding, thinning and damage removal applications.