Used DISCO DFG 840 #9219352 for sale

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DISCO DFG 840
Sold
ID: 9219352
Wafer Size: 8"
Back grinder, 8".
DISCO DFG 840 is a wafer grinding, lapping, and polishing system ideal for ultra-thin wafer thinning down to 5-10 μm. It features a grinding, loosening, and polishing process that helps form a smooth and uniform surface for quality semiconductor device production. The grinding process utilizes a number of vertically arranged grinding stones to precisely target and effectively grind wafers. The highly rigid grinding table and disc drives are designed to reduce vibration and ensure accurate movement of the grinding stones. The variable speed control allows for precise speed setting and equal grinding force in all directions. A high-precision grinding optical head delivers superior accuracy by preventing the displacement of the grinding stone from its original position. The loosening process utilizes slurry feed to help loosen the particles during wafer grinding and polishing. The back-grinding process can be controlled precisely through the addition of abrasive slurry and the usage of grinding arms. The polishing process utilizes a circular polishing table, which features a support base made of urethane rubber, as well as a stainless steel platen. There is also a built-in spray nozzle, which is used to evenly spread the polishing slurry throughout the polishing platen during the process. DISCO DFG840 is capable of handling up to 15 wafers at a time and is available in 600, 900 and 1200mm grinding / polishing tables. The system is also equipped with a program simulator, automated operation, and a graph output function to help operators adjust the parameters, process control and troubleshoot issues. The system is designed to provide a high degree of repeatability and is capable of achieving a 4nm or better surface roughness, making it ideal for wafer thinning applications.
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