Used DISCO DFG 840 #9243336 for sale

DISCO DFG 840 is a precision Wafer Grinding, Lapping, and Polishing equipment for silicon, sapphire, and other materials. It is a versatile and compact CNC system equipped with a full range of easy-to-use functions to produce the most precise surface and edge finish required for optimum performance of MEMS, Opto-electronic and other devices. The unit integrates two basic processes; Grinding and Polishing, to achieve surface lapping with minimal roughness and surface defects. Optionally, Surface Grinding or Polishing can be selected, as well for a wide range of material types. The Grinding process in the machine mainly involves grinding down a material surface using the diamond abrasives to allow it to a much uniformed surface by changing the surface temperatures from lower to higher. It uses specialized grinding wheel with embedded diamond grits to deliver precision surface finishes. The Polishing process utilizes a diamond slurries, which is dispensed onto the flat surface to lubricate the scratch-free lapping action. It makes use of a polishing element which operates very quickly to evenly disperse the polishing agents on the workpiece. In terms of controls, DISCO DFG840 tool is automated and provides users with an intuitive user interface for easy programming. It supports both manual and computer operation for rapid learning. It also offers a wide range of options such as selectable grinding and polishing mode, programmable finishing pressure, and timing parameters. Additionally, it includes powerful signal feedback and monitoring functions to help users to accurately monitor and adjust finishing parameters. The asset includes a thermal reaction chamber which precisely controls the thermal environment of the grinding and polishing process. By precisely controlling temperature within the chamber, this model ensures consistent and uniform grinding and polishing results regardless of environmental conditions. Finally, DFG-840 is an advanced wafer grinding, lapping, and polishing equipment ideal for any number of precision-related applications. It offers users greater precision, reliability, and efficiency compared to traditional polishing systems. The system is designed to make it easy for operators to produce high-quality finish required for higher yields, lower cost, and faster production rates.