Used DISCO DFG 840 #9281861 for sale

DISCO DFG 840 is a high-performance wafer grinding, lapping and polishing equipment designed to meet the most demanding process requirements. The system features a patented floating and force-feed design for single-wafer processing. The unit is an ideal tool for grinding, lapping and polishing various types of semiconductor materials and other substrates such as quartz and sapphire. The machine is based on a simple, yet powerful, design that incorporates a number of features essential to achieving high-throughput, damage-free processing. The wafer handling tool is designed to quickly and accurately orient and position the wafer. The asset is equipped with a patented gallium nitride force feeder to ensure consistency, repeatability and damage-free wafer positioning. The wafers are then secured to a vacuum chuck to eliminate the possibility of misalignment. The grinding, lapping and polishing process takes place in a hermetically sealed chamber. This chamber is designed to be pressure-tight, minimizing any potential contamination. The chamber is also equipped with an air removes model that extracts debris and airborne contaminants from the chamber. The equipment is capable of producing superior surface finishes on single or double-sided wafers. The wafer handling system allows for easy loading of the wafers and precise positioning within the chamber. The chamber itself is designed with a recirculation of fresh air that keeps the process area clean and safe for operation. The unit offers a variety of grinding, lapping and polishing media and abrasives for processing a variety of materials. Also, the machine can be configured with a variety of process controllers to monitor and adjust various parameters during the process. DISCO DFG840 tool is easy to operate and maintain and is capable of producing excellent surfaces finishes. It is well suited for single or small volume production runs as well as more complex, precision fabrication projects. With its patented force-feed and floating design, the asset warrants accurate, repeatable and damage-free processing. DFG-840 is an advanced, precision wafer grinding, lapping and polishing model.