Used DISCO DFG 840 #9281949 for sale

DISCO DFG 840 is a wafer grinding, lapping and polishing equipment designed for high precision and high yield applications as well as for heavy volume production. The system works with small wafers and can process up to 8,400 wafers per hour with a high rate of durability. The unit consists of three main parts - the grinding unit, the lapping unit and the polishing unit. The grinding unit is used to grind down wafers to the desired thickness and shape. This is done using a grinding wheel which is driven by an electric motor and has a variable speed control. The lapping unit is used to smooth out any unevenness or surface irregularities from the grinding process. This is done using a rotating lapping plate which is able to rotate at various speeds depending on the lapping material. The polishing unit finishes the process by polishing the surface of the wafer using rotating polishing wheel and a polishing compound which is applied to the wafer material. The machine is constructed with a die-cast aluminum frame and a stainless steel surface plate which ensures a perfectly flat base. This is necessary for planar grinding and ensures consistent results across the wafers. The tool is also equipped with several safety features and a dust collection port which ensures a healthy working environment with no dust particles in the air. The asset is also equipped with a computerized operating model which allows for automated grinding, lapping and polishing. This makes the process more efficient and allows for faster and more accurate results. In summary, DISCO DFG840 is a reliable and accurate wafer grinding, lapping and polishing equipment which is suitable for a variety of high precision and high yield applications as well as for heavy volume production. The system is equipped with a die-cast aluminum frame, a stainless steel surface plate, computerized operating unit and several safety features. This makes the machine easy to use and ensures a safe and healthy work environment.