Used DISCO DFG 8540 #9266377 for sale

DISCO DFG 8540 is a compact, high-performance wafer grinding, lapping and polishing machine. It is designed to provide reliable and precise processing of wafer surfaces while achieving high productivity. The equipment is configured with two programmable stages, each driven by its own motor. This allows for quick and efficient processing of wafers up to 8" in diameter. The upper stage is designed for grinding and lapping operations, while the lower stage is focused on polishing. Each stage can carry up to eight single-face or four double-sided wafers, allowing for maximum processing flexibility. High-precision linear measuring encoders precisely measure the spatial positions of the tooling. This ensures that the desired surface finish can be achieved with maximum accuracy and repeatability. The control system is designed for easy operation and programming, allowing the operator to set and save desired grinding, lapping and polishing parameters. The optional Diamond Compulsory Transmission Unit is also available, which allows for precise control of the movement of the spindle and tool surfaces. This feature greatly increases the accuracy and repeatability of the grinding, lapping and polishing results. In addition, the machine features a forced air cooling machine to ensure that critical components remain safe at all times. The machine's interior is also sealed, preventing contamination of the processed wafers. This ensures a clean working environment and allows the machine to process sensitive materials with ease. DISCO DFG8540 comes with a range of accessories, including various holders and tools, as well as a fountain basket to collect and recycle used abrasive materials. This makes it perfect for precision processing and large-scale production environments. DFG 8540 is ideal for high-volume production of large wafers that require a precise finish with minimum costs and maximum efficiency. Its reliable operation and high-precision results make it the perfect choice for any wafer-processing application.