Used DISCO DFG 8540 #9270086 for sale

DISCO CorporationDISCO DFG 8540 is a state-of-the-art equipment designed to precisely grind, lap and polish various types of thin-film wafers. The system is capable of grinding and polishing wafers up to 8-inches (200mm) in diameter with an astonishingly high degree of accuracy, meeting tolerance standards of 0.005 mm. In addition, DISCO DFG8540 has the capability to process several wafers concurrently, making it ideal for large-scale production projects. The main components of DFG 8540 include a control unit and four processing heads. The control unit is equipped with a wide range of advanced functions such as cleanroom-level SIL2-compliant safety features, adaptive grinding/polishing algorithms, and auto-load/unload functionality. It also offers a real-time data display and remote user-control of the unit via a web-based user interface. The four processing heads come with air bearings and are equipped with highly-precise wafer chucks that allow for maximum contact accuracy. During both grinding and polishing operations, these heads move with a high degree of accuracy and stability, ensuring that the finished wafer is free from errors. Additionally, the heads are also equipped with powerful motors and abrasive grinding/polishing media, offering both excellent grinding and polishing results. DFG8540 offer both manual and fully automated grinding/polishing options, making it perfect for both individual and large-scale production projects. For manual operations, operators can adjust, in real-time, the grinding/polishing rate and other settings to ensure optimum results on each wafer. For automated operations, the machine can be configured for automatic wafer feeding, wafer rotation and operation interval adjustment, allowing for maximum efficiency, throughput and accuracy. Overall, DISCO DFG 8540 Wafer Grinding, Lapping & Polishing Tool is an extremely powerful and precise asset that is capable of processing large numbers of wafers concurrently, ensuring a high-level of quality and accuracy. With its extensive range of features and capability, this model allows for rapid production of thin-film wafers with minimal errors.