Used DISCO DFP 8140 #9311797 for sale

DISCO DFP 8140 is a precision wafer grinding, lapping, and polishing equipment designed to achieve high-quality surface finishes and accuracy. Utilizing the latest technologies, this modular system is ideal for the production of high-value semiconductor device wafers that require exceptional surface quality and accuracy. DISCO DFP8140 features a large process chamber that is ideal for larger-diameter wafers. A high-pressure pneumatically-driven lapping table, combined with pressure pneumatic lapping plates, effectively removes even the toughest defects. To further ensure quality and accuracy, the unit also includes a precision grinding unit with an independently-controlled z-axis. This unit uses high-precision diamond discs to provide excellent surface finish and accuracy. The machine uses special polishing pads to provide a relatively stress-free polishing process, allowing for fewer wafer defects. The polishing pads are available in multiple patterns for different materials and applications. A wafer servo robotic transfer tool, combined with two individually-controlled high-precision turntables for wafer handling, ensures accurate positioning of wafers on the lapping and polishing tables. DFP 8140 has a simple user interface with an easy-to-understand graphical display for programming of process parameters. The asset's high-precision position encoders enable accurate control of lapping and polishing pads. Automatic monitor process parameters and warnings are also displayed on the LCD display for quick decision making. Additionally, the model allows for the integration of external process monitoring systems such as optical and electrical wafer testing. DFP8140 utilizes a computerized control equipment that is powerful enough to meet the changing needs in the semiconductor industry, and valuable enough to help reduce labor costs. The advanced design provides consistent repeatable results, while simultaneously providing reliability and flexibility. The result is an automated system that increases wafer accuracy and yields while minimizing process time.