Used DISCO DFS 8910 #9215124 for sale

DISCO DFS 8910 is a wafer grinding, lapping and polishing equipment designed for high-tech requirements. It offers efficient, flexible and repeatable processes to produce high-quality wafers for a range of applications. By combining several process steps in one system, DISCO DFS8910 provides the highest level of efficiency and precision for production and quality assurance. DFS 8910 unit is based on a multiple-stage wafer grinding, lapping and polishing process. The machine is composed of several components which provide an optimized workflow. This includes a grinding, lapping and polishing machine, a loading station, and a degreaser. Besides its high performance, the tool also offers superior process flexibility with a wide variety of applications. The grinding stage of DFS8910 asset uses a CNC-controlled grinding machine for accurate, repeatable results. The nip ring model ensures exact gap control and uniform wafer edge profile. The machine performs grinding, lapping and polishing in a three-stage process, with exact control of the process parameters. Furthermore, the equipment offers excellent dust collection for the grinding and lapping stages. The cleaning station is equipped with a special dust collection system and ionized air knife to remove residual particles from the wafers. The degreaser further cleans the wafers after the cleaning station. Additionally, the degreaser helps reduce particle contamination and improve the wafer's surface quality. DISCO DFS 8910 offers comprehensive process monitoring and traceability. With standard recipes preloaded for different types of wafers, the unit can be customized to meet unique process requirements. The machine also supports integration with other wafer processing systems and can be used in both a manual or automated mode. DISCO DFS8910 provides a comprehensive solution for wafer grinding, lapping and polishing. It offers superior performance, process flexibility and robust process control for high-quality wafer production. Furthermore, its customizable recipes and automatic process control allows for increased efficiency, repeatability and traceability. This tool supports the production of high-performance wafers for multiple applications.