Used DISCO DFS 8910 #9220502 for sale

DISCO DFS 8910 is a wafer grinding, lapping, and polishing equipment, used to achieve maximum accuracy of processing. The system, manufactured by the Japanese company DISCO Corporation, is well known for its superior grinding, lapping, and polishing capabilities. Utilized in various industries all around the world, it is hailed as the most advanced wafer processing unit currently available. DISCO DFS8910 has an integrated machine design, which makes it very easy to operate as well as efficient, producing high-quality results. It consists of a powerful grinding spindle, a two-spindle lap head that enables both lapping and polishing, and an all-axis motion tool which can be controlled by a CNC program. The machine's body is reinforced concrete and steel, and provides superior vibration dampening and heat dissipation, greatly increasing longevity and accuracy. In addition, DFS 8910 features a number of options and accessories to increase its usability. The optical table base, with a variety of motion choices, enables the achievement of higher accuracies for critical measurements such as flatness or parallelism. It also features a coating asset with static, dynamic, or diamond-like carbon coatings, increasing the life of the wafer. Moreover, it has a wide range of available polishing materials to meet any desired needs. It can process both compound materials with a wide range of granulation levels and polishing pads for different surface finishes. As an example, this model is widely used in the production of etched and polished wafers. Additionally, DFS8910's equipment automation ensures simplified operation by eliminating any complex loading and unloading of parts, reducing cycle time while still delivering precise results. Overall, DISCO DFS 8910 is the gold standard in wafer grinding, lapping, and polishing systems, since its quality and accuracy are unmatched. With its integrated design and multiple optional features, it is the perfect choice for any production environment needing precision-oriented wafer processing.