Used DISCO DFS 8910 #9268875 for sale

DISCO DFS 8910 Equipment is a specialized, automated wafer grinding, lapping and polishing system designed to produce uniform, high-quality results in critical semiconductor production applications. The unit can polish wafers up to 8" in diameter (and up to 10" with special fixtures). The machine consists of two main units - the Upper tool unit and a Lower Asset Unit. The Upper Model Unit houses the grinding/lapping/polishing processing technology. A grinding wheel with adjustable speed and profile is used to remove excess bulk material. The equipment can support a variety of grinding wheels for surface profilings. A polishing pad is then used to finish off the grind-profile, to create a flat and smooth surface. The polishing pad is designed to reduce edge chippings and reduce striations. The Lower System Unit houses the wafer-holder, work-holder clamp, power supplies, and audio/visual cabinet. The wafer-holder ensures the secure positioning of the wafer during processing. The work-holder clamp securely fastens the wafer to the polishing plate. With special fixtures, the unit can also accommodate wafers up to 10" in diameter. The machine also includes a simplified control panel with automatic memory programming and multi-function LCD display. This allows the user to intuitively operate the tool, and to easily adjust the parameters for repeated processes. It also provides multiple safety features to ensure safe operation of the asset. The model is designed to be efficient and economical - offering simple operation and maintenance. The equipment is also designed to produce superior results - with its efficient grinding, lapping and polishing processes, and 8" wafer capacity. Its performance is enhanced by investment in the finest components and quality control procedures for wafer-specific processes. This ensures consistent productivity and repeatability, saving time and money. Overall, DISCO DFS8910 System is an ideal solution for high-precision wafer grinding, lapping and polishing applications. It has been specifically designed to provide optimal performance, reliability, repeatability and efficiency. With its simple operation, flexible design, and comprehensive safety, the unit is an ideal choice for any semiconductor production process.