Used DISCO DFS 8910 #9275637 for sale

DISCO DFS 8910 Wafer Grinding, Lapping and Polishing Equipment is a fully automated, multi-purpose processing machine designed for grinding, lapping, and polishing of semiconductor wafers. It is equipped with several process modules, allowing it to efficiently and accurately perform a wide variety of processes, including grinding, lapping, polishing, etching, and cleaning. The machine features a modular design, allowing users to add or remove features as required. Its modular construction also enables the system to easily integrate into any semiconductor fabrication line. DISCO DFS8910 is powered by a servo motor drive, which is capable of delivering precise motion and positioning control to achieve the desired material removal rates. It can easily be adapted to process a variety different size wafers, from 200mm wafers to the smallest 3"wafers. The machine is equipped with a patented "Diamond Flow Unit", which provides highly effective abrasive processes for grinding, lapping, polishing, and etching. This machine efficiently removes material from the surface of the wafer in a single step, resulting in a low defect rate. The tool is also designed to maintain an even level of pressure on the wafer, leading to uniform material removal and improved overall process yields. The asset's software interface allows for automated control of the grinding, lapping, and polishing process. This model contains features such as a dedicated user interface, off-line programming capability, and an integrated monitoring and control equipment. This software is fully upgradeable and configurable, allowing users to customize the system as their production needs evolve. DFS 8910 is fully compliant with industry standards and is an ideal solution for the production of thin wafer surfaces. This unit offers a high level of control over the whole process, while providing low material cost and high reliability. Thanks to its flexible design, the machine is able to generate optimum results for almost any application, from simple surface finish preparations to extremely complex processes such as fully automated precision wafer lapping. The wafer grinding, lapping and polishing tool also provides excellent service and maintenance support to ensure the best performance.