Used DISCO DFS 8910 #9284016 for sale

DISCO DFS 8910 is a versatile wafer grinding, lapping and polishing equipment that provides single-sided machining and double-sided machining with high precision and accuracy. DISCO DFS8910 is a large-scale wafer grinder, lapper and polisher with a wide range of capabilities. It is designed to meet the strict requirements of the semiconductor industry for stable and precise processes. The machine is built with advanced automated control systems, which provide improved accuracy and production consistency. The machine is constructed with a robust frame, which is built using heavy-duty steel ensuring reliability in harsh industrial environments. The machine features four stations: grinding, lapping, and polishing stations. The grinding station is equipped with circular grinding wheels, which rotate along the circumference of the round wafer. This station removes surface imperfections and irregularities from the wafer surface. The lapping station is equipped with emery, lapping film, and diamond lapping wheels. This station removes the fine surface features from the wafer. The polishing station is equipped with Honing disks and resin diamond polishing wheels. This station completes the wafer polishing process, attaining a highly polished and defect-free wafer. The transport system is advanced in DFS 8910. It consists of a vacuum transport unit, which enables precise wafer handling. The wafer is secured by vacuum during transport, preventing damage from external forces or shock. The machine design also ensures balanced forces across the wafer, providing a consistent wafer finish. The machine features an advanced control machine that ensures precision and repeatability in the wafer machining process. Numerical error is minimized, and process variables are closely monitored and monitored for consistency. The machine is also equipped with an optical microscope for higher accuracy, which further improves the surface roughness and repeatability of the wafer processing. Overall, DFS8910 is a large-scale, industrial-grade wafer grinding, lapping and polishing tool that provides single-sided machining and double-sided machining with superior accuracy and repeatability. The machine's advanced control asset ensures a consistent and precise wafer processing; its robust frame ensures stability and durability in harsh industrial environments, and its transport model secures and evenly distributes the wafer during machining.