Used DISPERSION TECHNOLOGY (Wafer Grinding, Lapping & Polishing) for sale

Dispersion Technology is a renowned manufacturer of wafer grinding, lapping, and polishing equipment. Their systems are designed to provide precise and efficient processes for the semiconductor industry. The company offers a wide range of units, including the DT-1200, which is highly regarded for its advanced features and capabilities. Wafer grinding machines by Dispersion Technology utilize state-of-the-art technology to reduce wafer thickness and ensure uniformity. These tools enable precise control over grinding parameters and offer excellent accuracy and repeatability. With their robust construction and innovative design, they provide superior performance and reliability. Lapping assets from Dispersion Technology are designed to achieve high-quality flatness and remove residual damage caused during grinding. These models employ advanced abrasives and precision controls to ensure consistent results. They offer a wide range of applications such as rough lapping, fine lapping, and polishing. Polishing equipment by Dispersion Technology utilize advanced polishing pads and slurries to achieve desired surface finish and planarity. These systems offer excellent control over polishing parameters, allowing operators to achieve precise results. They are ideal for CMP (Chemical Mechanical Polishing) applications and enable efficient and uniform polishing of wafers. Dispersion Technology's units have several advantages over their analogues. They offer enhanced automation, advanced process controls, and higher productivity. The machines incorporate innovative features like real-time monitoring, data logging, and recipe management, making them user-friendly and highly efficient. Additionally, the company provides excellent customer support, ensuring smooth operation and maintenance of the tools. The DT-1200 is a notable example of Dispersion Technology's wafer grinding system. It offers advanced wafer handling capabilities, high-speed grinding, and exceptional throughput. The DT-1200 is equipped with advanced sensors and controls for precise process monitoring and control. It provides excellent flatness and thickness uniformity, making it suitable for various applications. Overall, Dispersion Technology's wafer grinding, lapping, and polishing assets are known for their reliability, performance, and advanced features. With a wide range of applications and excellent customer support, they are preferred by semiconductor manufacturers worldwide.