Used EBARA EPO-223 #118608 for sale

Name: EBARA EPO-223
Brand: EBARA
SKU: 118608
Availability: SoldOut

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

Tap to zoom

Sold

Wafer Grinding, Lapping & Polishing

Manufacturer

EBARA

Model

EPO-223

ID: 118608

Wafer Size: 8"

Vintage: 1997

Tungsten CMP system, 8" Process type: W-CMP Pad conditioner: dresser type Pad conditioner head: brush type Pad conditioner holder: universal Load / unload unit type: cassette Robot: Rorze, dual arm In-situ removal rate monitor: yes SEC GEM interface Platen & Head Options: Polishing head: normal head Retaining ring: normal type Platen temperature control: yes Slurry Delivery Options: Slurry delivery: 3-line Slurry flow rate: STD; 50 ml/min to 500 ml/min Slurry flow monitor: Polisher-2, 1-line display Slurry facilities: slurry supply unit, 2 system System S/W Status: Panel Com S/W: 2.3.5 O/S Com S/W: 4.01.00 System Safety Equipment: Red turn to release EMO button: STO EMO guard ring: yes System labels: Japanese Earthquake brackets: yes LO to disconnect on polisher: yes Polisher tower mounting type: 3-color pole Cleaner options: integrated; roll brush + roll brush + pencil & SRD 200V, 3 phase, 60Hz, 100A 1997 vintage.

Read More Close

EBARA EPO-223 is a state-of-the-art wafer grinding, lapping and polishing equipment designed to provide superior quality and accuracy for wafer machining operations. EPO-223 is ideal for applications requiring high precision during lapping, polishing and grinding of wafers. EBARA EPO-223 system consists of a grinding platform, integrated with a tabletop 3-axis motion platform, automatic polishing head and spindle drive. The grinding platform consists of a rotating polishing table, a rotary motion mechanism and a rotary motion drive. The grinding platform is stationary, while the tabletop motion platform is driven by the polishing head and spindle drive which are capable of generating maximum speed of 150 rpm. The rotating polishing table provides a planar surface that is consistent in size, flatness and parallelism. The v-shaped base on the polishing table is designed to provide a secure and stable base for the wafers or substrates during machining. The rotary motion provides efficient and repeatable operation with minimal vibration. The 3-axis motion platform, with a maximum travel of 350 mm, drives the polishing head and spindle drive. It is designed to provide accurate and repeatable operation, allowing for precise and controlled wafer grinding, lapping and polishing. The adjustable speed of the polishing head and spindle drive can be accurately set from 0 to 150 rpm in order to achieve high-quality results. The automatic polishing head is designed to provide a uniform and smooth finish on the wafers. It is equipped with an adjustable resistivity feedback monitor, providing a method to measure and adjust the polishing speed and pressure as needed in order to maintain the desired results. Additionally, EPO-223 includes a variety of safety features to ensure operator safety. It is equipped with a mechanical emergency stop button, a pressure regulator and a lubricant pump which keeps the motion platform well lubricated. In conclusion, EBARA EPO-223 is a powerful and reliable wafer grinding, lapping and polishing unit designed to produce superior quality and accuracy for wafer machining operations. This machine combines the precision of a grinding platform, the accuracy of a 3-axis motion platform, the precision of an automatic polishing head and spindle drive, as well as safety features for increased operator safety.