Used EBARA EPO-223 #118609 for sale

Name: EBARA EPO-223
Brand: EBARA
SKU: 118609
Availability: SoldOut

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Wafer Grinding, Lapping & Polishing

Manufacturer

EBARA

Model

EPO-223

ID: 118609

Wafer Size: 8"

Vintage: 1997

Tungsten CMP system, 8" Process type: W-CMP Pad conditioner: dresser type Pad conditioner head: brush type Pad conditioner holder: universal Load / unload unit type: cassette Robot: Rorze, dual arm In-situ removal rate monitor: yes SEC GEM interface Platen & Head Options: Polishing head: normal head Retaining ring: normal type Platen temperature control: yes Slurry Delivery Options: Slurry delivery: 3-line Slurry flow rate: STD; 50 ml/min to 500 ml/min Slurry flow monitor: Polisher-2, 1-line display Slurry facilities: slurry supply unit, 2 system System S/W Status: Panel Com S/W: 2.3.5 O/S Com S/W: 4.01.00 System Safety Equipment: Red turn to release EMO button: STO EMO guard ring: yes System labels: Japanese Earthquake brackets: yes LO to disconnect on polisher: yes Polisher tower mounting type: 3-color pole Cleaner options: integrated; roll brush + roll brush + pencil & SRD 200V, 3 phase, 60Hz, 100A 1997 vintage.

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EBARA EPO-223 is an automated wafer grinding, lapping and polishing equipment designed to offer excellent flatness and surface finish. Utilizing advanced technologies, EPO-223 is capable of processing anything from small chips to large wafers up to 300mm in diameter. EBARA EPO-223 is equipped with a high speed, three-axis grinding spindle, nozzle and wafer holder for precise wafer handling and processing. With a powerful motor, this spindle has a fast grinding speed and a high accuracy that allows it to achieve high efficiency and uniformity in wafer grinding and lapping. EPO-223 also offers a precision surfacer, which provides accurate, repeatable lapping and polishing operations. It is equipped with the latest advancements and technologies, such as a grinding agent pre-set system, high-precision dynamic surface metrology, and integrated motor-radiometric control. The surfacer also comes with a 4-blade, dynamic profiling unit for ultra-fine polishing operations. One of the most impressive features of EBARA EPO-223 is its high-speed grooving machine, which ensures tight gap control, superior depth, and unsurpassed flatness performance. With its built-in dressing and profiling capabilities, the grooving tool provides reliable, repeatable performance every time it is used. The asset also offers a wafer handling robot, allowing for automatic loading and unloading of wafers. Additionally, EPO-223 is designed with a high-end motion controller, allowing for a wide range of programs and macros to improve productivity and accuracy. Overall, EBARA EPO-223 is a cutting-edge, automated wafer grinding, lapping and polishing model that provides superior performance, flatness and surface finish. With its advanced features and technologies, EPO-223 offers superior process capabilities and improved throughput, making it an invaluable tool for any wafer processing application.