Used EBARA Frex 200 #9273890 for sale

EBARA Frex 200 is a versatile equipment designed to meet the needs of today's growing wafer grinding, lapping, and polishing industry. This system is capable of providing exceptional accuracy, features, and speed in a variety of applications. It offers a wide range of ceramic, polycrystalline, and metal substrates with optimum surface finish, no matter the material. EBARA FREX200 can provide simultaneous grinding, lapping, and polishing of up to 5 substrates of different sizes at a maximum speed of 9000 rpm. The unit is composed of an elevator base with a foundation, an adjustable holder, a wheel platform on the left side, control panel on the front, and a base cover. On the left side of the unit is the grinding and lapping wheel platform, equipped with individually adjustable disc holders, a wheel brush, and a wheel cover. The adjustable holder provides users with the ability to precisely position the grinding wheel and work pieces. The disc holders are adjustable both horizontally and vertically providing for fine-grain adjustment. The wheel brush removes any dust collected during grinding and lapping and helps to keep the wheels clean during operation. FREX-200 is equipped with a powerful motor and high-grade bearings for precise mechanical operations. The closed loop microprocessor-controlled machine is capable of providing maximum fine precision and accuracy through the feedback of sensors. This is achieved by a rapid evaluation of the wheel and the work piece during the grinding, lapping, and polishing process. The tool is highly user-friendly, and is designed specifically with ergonomics in mind. The control panel located at the front of the asset provides simple one-handed operation and allows for fine control over the speed and pressure settings. Additionally, the safety model avoids interference with the work pieces and only grinds when the target pressure has been achieved. The whole equipment is housed in a stainless steel shell for ideal insulation and protection. In conclusion, F-REX200 Wafer Grinding, Lapping, and Polishing system is an efficient and reliable unit designed to provide optimal performance. Its user-friendly interface and precise control allow for precise grinding, lapping, and polishing to meet the needs of any project.