Used EBARA Frex 300 #9152437 for sale

EBARA Frex 300 is a 'wafer grinding, lapping & polishing' equipment that facilitates manual, semi-automatic, and fully automated modes. It allows wafer manufacturers to optimize and streamline their operations, while significantly decreasing the cost and time associated with the process of preparing wafers for further processing or assembly. EBARA FREX-300 is designed to perform a wide range of operations, including grinding, lapping, and polishing of wafers up to 6 inches in diameter. The system is composed of a number of modular components that can be customized to suit individual needs. The main components are a control unit, a grinding head, and two polishing heads. The control unit is a touch panel interface with an LCD display for configuring and monitoring the process. It also includes a variety of sensor inputs and outputs for controlling the speed and pressure of the grinding and polishing heads. The grinding head, the primary component of the unit, is designed to abrade the surface of the wafer and smoother its edges. It contains a high-speed spindle which can be adjusted for speed and pressure to ensure a consistent and precise grind. The two polishing heads are used to smooth, finish, and brighten the workpiece. The first head is a fixed polishing arm, and the second head is a vibrating polisher that applies a more gentle, even pressure to the workpiece. Both heads are equipped with spindles that can be adjusted to increase and decrease the pressure they apply to the workpiece. F-REX300's unique, modular design, and extensive range of adjustability and control, allow it to be tailored to the needs of individual manufacturers, and to be used for many different applications. It also offers a variety of safety features, such as a door sensor to prevent accidental contact with the spinning head, and emergency stop functions. Additionally, the machine can be equipped with a variety of wafer holders, so that wafers of different sizes can be processed in one set-up. Frex 300 is an efficient, cost effective, and reliable way to prepare wafers for further processing or assembly.