Used EBARA Frex 300 #9252531 for sale

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EBARA Frex 300
Sold
ID: 9252531
Wafer Size: 12"
CMP System, 12".
EBARA Frex 300 is a high-performance wafer grinding, lapping and polishing equipment designed to address the demanding requirements of the advanced semiconductor industry. It is a highly accurate and reliable system that includes a state-of-the-art grinding head, integrated with a powerful motion unit, advanced control software and a range of sophisticated lapping and polishing accessories to ensure consistent and repeatable results on a range of substrate materials. The grinding head in EBARA FREX-300 is equipped with a proprietary metal bond diamond grinding wheel which is capable of performing single-step grinding operations with excellent surface quality, accuracy and throughput. This wheel is capable of accommodating different sizes and types of wafers and can work with adjustments to the gap size to accommodate different wafer thicknesses. The grinding head also provides vertically integrated servo and rotary axes to enable highly precise adjustments, and it has a 5-axis drive machine for finely tuned control over motion. The integrated advanced software in F-REX300 allows for sophisticated cycle planning and process settings which can be adjusted and stored on the tool. This permits a wide range of grinding and polishing recipes to be used in various applications, allowing the operator to find the best choice for their specific application. The asset also features a PLC-based control model which ensures the grinding and polishing process remains consistent. Additionally, F-REX 300 is also equipped with a suite of lapping and polishing accessories that allow it to perform fine polishing operations. These accessories include a range of polishing foam, felt and paper that can be used to achieve different grain sizes and finishes. Additionally, the equipment includes a diamond slurry injection system and a compound dispenser to facilitate the precision grinding, lapping and polishing operations. In conclusion, Frex 300 is a powerful and versatile grinding, lapping and polishing unit that provides accuracy, throughput and repeatability for advanced semiconductor materials and components. Its comprehensive suite of grinding, lapping and polishing accessories gives it a significant edge in the industry, allowing it to produce highly precise results with optimal surface finish.
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