Used EBARA Frex 300S #9245371 for sale

EBARA Frex 300S is a wafer grinding, lapping and polishing equipment which is designed to provide precision surface finishing for silicon and other electronic materials used in the semiconductor industry. The system is built to exacting standards and engineered to provide excellent process repeatability and high throughput. The unit provides a delicate balance of grinding, lapping, and polishing in order to achieve the desired surface accuracy, surface quality and device performance. The machine consists of a grinding/ polishing spindle, lapping fixture, lapping platen, turbo spin plates, and a polishing head. The spindle is powered by a servomotor which provides precise speed and torque control. The lapping fixture is designed to hold the material securely in place and at the required angle during the grinding process. The lapping platen is used to hold the substrate against the lapping surface to ensure a uniform surface quality. The turbo spin plates offer high speed polishing capabilities, allowing for maximum performance. The polishing head is designed for a variety of materials, providing a fine finish on delicate substrates. The tool is equipped with a range of user friendly features which simplify the grinding, lapping and polishing process. Features include an integrated monitoring and control asset, digital readout display, data logging, and optional laser interferometer measurement capabilities. The integrated monitoring and control model allows for accurate process control and optimum process repeatability. The digital readout display graphically displays process parameters which can be adjusted as needed. Data logging provides an accurate record of the process and can be used to analyze and refine future processes. Optional laser interferometer measurement capabilities offer superior accuracy over manual methods. EBARA FREX300S is the ideal tool for providing the high precision surface finish required for today's advanced technologies. The equipment's combination of powerful grinding, lapping and polishing capabilities and user friendly features makes it an invaluable tool for achieving the accuracy and quality necessary for semiconductor and other electronic components.