Used EBARA Frex 300S2 #9245370 for sale

EBARA Frex 300S2 wafer grinding, lapping & polishing equipment is a highly advanced and versatile solution for wet and dry wafer grinding, lapping and polishing operations. The system is designed to meet the exacting standards of the semiconductor industry, offering a economical solution with substantial cost savings without sacrificing process performance. Equipped with an independent two-wheel spindle unit, EBARA F-REX300S2 offers automated grinding, lapping and polishing capability with a wide range of configurations. An overhead Motor- Driving Head (MDH) and a Direct-Drive Unit (DDU) provide each wheel with their own individual motor and provide an independent control machine that allow for precise control of the grinding, lapping, and polishing operation. The tool is capable of allowing for adjustable rotation speed and corresponding abrasive force in order to accommodate various size wafers, while maintaining process repeatability and accuracy. The wheels' twin-level spindle design provides superior process precision and positioning accuracy. Additionally, the asset can be configured with various lapping plates and polishing fabric types to allow for flexibility in the processing environment. FREX-300 S2 also offers the option of the MDH head equipped with a robotic arm allowing for quick and easy loading and unloading of the wafers. This allows for faster throughput with reduced manual labor and lower manpower costs. Further, the model is equipped with a powerful process controller which is capable of monitoring real-time process data, displaying the necessary parameters, and providing full control of the equipment from start to finish. This controller can store up to 99 process recipes and the ability to monitor and record process data as well as provide process adjustment to ensure uniformity in the polishing process. Overall, F-REX300S2 wafer grinding, lapping & polishing system is a highly advanced and reliable solution for processing semiconductor wafers, providing a cost-efficient process with superior performance, data accuracy, and process repeatability. With its versatile configuration, adjustable speeds, and robotic arm option, this unit offers the necessary technological solutions to meet the exact requirements of semiconductor manufacturers.