Used HARIG 618 #9009184 for sale

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HARIG 618
Sold
ID: 9009184
Hand feed surface grinder Travel: 19" x 6.75" Needs 6" x 18" magnetic chuck Grinding wheel: 7" x 0.5" x 1.25" Elevating wheel granulations: 0.0005" Gross feed wheel granulations: 0.001" 3,540 rpm Direct spindle drive 1 HP 220/440/3/60.
HARIG 618 wafer grinding, lapping and polishing equipment is designed for precision wafer processing with a combined platform designed to maximize throughput, reduce costs and offer the highest level of precision machining available. The versatile 618 features a high-torque 1 HP spindle motor and variable-speed inverter drive for fast and easy preset spindle speed adjustment. HARIG 618 also offers digital readout for precise micrometer and depth-of-cut control. It is capable of grinding, lapping and polishing wafers with maximum uniformity. 618 also offers precision linear feeds for precise machining. The feed rate is adjustable in 0.05 increments allowing for more control and accuracy. HARIG 618 also features a high-resolution microscope system to inspect the wafer during and after processing. The microscope unit is equipped with a zoom lens for accurate viewing and detection. The machine enables precise inspection and repeatable processes in either manual or auto modes for greater process control. 618 also features adjustable vacuum chucking and diamond wheel dressing that enables quick and accurate dressing of diamond wheels. The chucking tool has adjustable pressure and speed control for efficient loading and unloading of wafers. HARIG 618 is designed for use in semiconductor and other industries requiring precision wafer processing. It is ideal for thin wafers and tight tolerances up to 5 microns. 618 is a versatile grinding asset and is capable of providing excellent results for a variety of wafer processing operations. HARIG 618 also offers many safety features including a digital display for visual control of all machine functions. It also has several electronic safety functions, including a control switch interlock and door release mechanism, as well as a safety emergency stop model for maximum safety and accuracy. 618 is a reliable and cost effective solution for wafer grinding, lapping and polishing. It is designed with precision engineering and advanced technology, offering superior results. Its intuitive and user-friendly interface allows for quick setup and operation, and its adjustable components make it easy to cater to specific project demands.
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