Used LOG-O-MATIC LS Ingot #9158822 for sale

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ID: 9158822
CNC Grinding machine.
LOG-O-MATIC LS Ingot is an advanced wafer grinding, lapping and polishing system specifically designed for semiconductor thin-film processing. It offers high performance, accuracy and reliability for use in industrial production and laboratory environments. The system consists of a motorized gantry, a grinding head, a variable speed controller, and adjustable grinding tools. The motorized gantry mounts directly to the bottom of the grinding head and allows for rapid movement in the x-y-z axes. This allows operators to precisely control the grinding action and to achieve fast, accurate grinding results. The grinding head is made of a hard, wear-resistant material and features adjustable grinding wheel holders and feeders. It can be used to perform a wide range of grinding operations including planarization, notch grinding, lapping and polishing. The adjustable grinding tools let operators fine-tune the grinding and polishing operations, allowing them to customize the wafer surface properties according to their specific needs. The variable speed controller allows the operator to control the feed rate, allowing them to adjust the feed rate to optimize the process and minimize material removal. LS Ingot is also equipped with a strong, robust construction, making it highly resistant to outside forces. The air bearing construction ensures smooth motion of the grinding head and eliminates the possibility of any resonance. The grinding head is also easily disassembled, allowing for rapid changeover and onsite maintenance. Overall, LOG-O-MATIC LS Ingot is an advanced and reliable wafer grinding, lapping and polishing system designed for industrial production and laboratory use. It offers rapid, precise motion and adjustable grinding tools, allowing operators to adjust the wafer surface properties to their specific needs. It is also robustly constructed to resist outside forces and features an easy-to-use design, allowing for rapid changeover and onsite maintenance.
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