Used NAICHI FUJIKOSHI 30B #9097962 for sale

NAICHI FUJIKOSHI 30B is an advanced wafer grinding, lapping and polishing equipment designed specifically for the precision machining of semiconductor materials. Using advanced technologies, such as diamond composite grinding wheels and highly accurate motion control systems, 30B achieves superior surface finishes on a wide range of wafer sizes and shapes. NAICHI FUJIKOSHI 30B utilizes a truerly innovative 3-axis precision machining platform which achieves unparalleled motion control accuracy compared to conventional systems. This is done through a combination of linear and rotary stages, precision ball-screws, ceramic bearings, and specialized motors and controllers. The combination results in ultra low velocity stiction and vibration that allows for consistent polishing formation and wafer flatness as uniform as 0.5 microns across the full range of wafer sizes. 30B comes with a range of advanced grinding wheels that provide optimum finishing for various wafer shapes and sizes. This includes diamond composite grinding wheels designed for high precision machining processes, such as jig grinding and lapping. The wheels are easily changed out to provide a wide range of grain size and particle size combinations. NAICHI FUJIKOSHI 30B also offers a range of advanced software solutions that allow for unparalleled levels of control over the process. This includes an integrated vision system, a fully featured grinding and lapping data manager, and a data tracking and analysis unit. The software allows users to optimize the grinding and polishing process, provide detailed performance metrics, and track critical process parameters in real-time. Overall, 30B is an advanced machine designed to provide impressive precision machining and superior surface finishes. Its intuitive design, advanced technology, and advanced software tools make NAICHI FUJIKOSHI 30B an ideal choice for wafer processing needs in the semiconductor industry.