Used OKAMOTO GNX 300 #293822981 for sale

OKAMOTO GNX 300 is a wafer grinding, lapping & polishing equipment designed specifically for use in semiconductor production. This powerful system offers a cost-effective and high throughput solution designed to meet the needs of today's high-volume production environments. OKAMOTO GNX300 offers superior productivity and quality control with its advanced control systems, including an onboard computer control, encrypted operating software, and touch panel programming capabilities. Utilizing the lapping plate motion and oscillation, the unit can precisely control parameters such as lapping forces and speeds with custom programs to meet the demands of any wafer shape, size, and surface finish requirements. GNX-300 also incorporates several safety systems, such as fail-safe systems to guard against incorrect settings, failsafe outlets to protect against machine jamming, and an emergency stop button to immediately halt operation in case of an emergency. In addition, three-stage internal filtration systems reduce dust and other airborne contaminants. The machine can process various materials, including stainless steel, copper, aluminum, polycrystalline diamond and single crystal diamond. OKAMOTO GNX-300 features dual intensifiers, high-flow recirculating pumps, efficient filters and a high-capacity process tank. The dual intensifiers provide operating purity, high-flow recirculating pumps enable precision lapping and polishing of ultra-thin wafers and robust filtration systems ensure a safe working environment. GNX300's combination of features and performance make it an ideal solution for handling process-intensive semiconductor production jobs. The machine is highly efficient and able to provide consistent results when processing even the thinnest wafers. It also provides exceptional accuracy and repeatability across multiple parts. Overall, GNX 300 is a reliable tool designed specifically to meet the demands of today's high-volume production environments. With its cost-effectiveness, reliable performance, and high throughput capabilities, it is an ideal solution for efficiently processing a wide range of materials that require precision lapping and polishing.